DYDPJ-5120C ARM Embedded System Training Platform

Technical Parameters

1.Core board hardware parameters

1.1CPU: OMAP3530 DCUS, 600-MHz ARM Cortex-A8 Core 412-MHz TMS320C64x+ DSP Core, integrated memory for ARM CPU (16kB I-Cache, 16kB D-Cache, 256kB L2) and on-chip storage (64kB SRAM, 112kB ROM )

1.2DDR RAM: 256MB DDR RAM MT29C2G48MAKLCJA-6IT

1.3FLASH: 256MB NAND FLASH MT29C2G48MAKLCJA-6IT

1.4 Power management: independent power management chip TPS65930

1.5LDO: equipped with LDO

2. Baseboard hardware parameters

2.1FPGA: XC3S250E-P208 is used to control logic and expand serial ports, and assign addresses to corresponding devices.

2.2 Ethernet: 1 10/100M adaptive Ethernet controller DM9000A

2.3LED: 12 GPIO-controlled LED working status indicators: 6 located on the core board and 6 located on the base board

2.4 Audio: Standard AC97 audio controller small three-core interface + MIC head TPS65930

2.5 Reset: Isolate internal and external reset signals to increase reset reliability TC7SH08FU

2.6UART: A total of 7 UART channels: 3 channels are built-in with the processor, 4 channels are externally expanded by FPGA, 1 channel is connected to the infrared, 2 channels are connected to the expansion interface, and 4 channels are connected to the DB9 connector.

2.7RTC: Independent RTC 1220 battery powered

2.87-inch LCD: 7-inch 24-bit LCD screen with resistive touch screen 16:9 display, resolution: 800 × 480 connected to DSS (AT070TN83)

2.91.8-inch LCD: 1.8-inch TFT LCD, resolution 128*160, mounted on the GPMC bus (HX8310)

2.10 Touch screen interface: SPI extends the touch screen interface, and the touch screen is matched with the 7-inch screen (TSC2046)

2.11TV-OUT: One S-VIDEO interface, mixed video signal

2.12BUFFER: Has a bus buffer for easy isolation and replacement

2.13DVI: One DVI interface, which can output DVI-D high-definition signal (TFP410) with a resolution of 1280x720 and a code rate of 30fps.

2.14WIFI+BT: WIFI+BT+FM three-in-one module expands WG7310-00 module (WL1271) through SDIO

2.15IrDA: Infrared sensor , infrared transmission (HSDL-3600#017)

2.16 Power supply: external DC power supply 12V or 5V power supply, 5A or 3A power supply

2.17 Power interface: Reserved 3V, 5V, 12V power interfaces

2.18IIC interface: 2 IIC and one IIC expansion interface

2.19SDIO interface: external WIFI and Bluetooth

2.20SPI interface: 2-way SPI expansion interface

2.21 digital tube and LED dot matrix: 4 digital tubes, 1 16x16 dot matrix

2.22 full keyboard: Expandable special keyboard for this computer through USB port

2.23 matrix keyboard: 4x5 independent matrix keyboard

2.24 camera: High-quality camera OV3640 300W pixels, which can realize H.264 video real-time encoding and decoding, 30 frames per second, can be used for taking pictures and video calls

2.25SD/MMC: 1 high-speed SD/MMC card interface

2.26JTAG: 1 channel 20PIN ARM JTAG, 1 channel 10PIN FPGA JTAG

2.27 Temperature sensor: LM75

2.28USB HOST: 4 USB HOST high-speed interfaces, supporting USB mouse, keyboard, Bluetooth, U disk, camera and wireless network card. Expand the two-level HUB with a total of 7 av*lable USBs (FE1.1)

2.29USB OTG: Mini USB AB interface one

2.30AD: 4 channels AD: 3 channels 16bit AD7792, 1 channel 8bit ADS1110

2.31 buttons: 6 GPIO control buttons, preset functions, user-definable functions, 4 fixed function buttons

2.32EEPROM: 16K (24C16)

2.33 DIP switch: 1 group (32 bits)

2.34 power supply: external 12V/3A DC power supply, internal LDO voltage stabilization

2.35 bus expansion interface: 192pin European socket expansion, bus, serial port, IIC, GPIO, etc., supports the following optional expansion modules (optional):

(1) Fingerprint expansion module

(2) IEEE802.15.4 Zigbee expansion module

(3) FM module

2.36SENSOR MODULE (optional):

Expandable: 6-in-1 sensor expansion module (temperature, humidity, photoelectric sensor, pressure sensor, proximity switch, photoelectric switch)

3.Experimental requirements

3.1Win CE experiment

Experiment 1: Set up WINCE6.0 development environment

Experiment 2: Establish WIN CE6.0 platform and export SDK

Experiment 3: Programming WINDOWS CE

Experiment 4: Establish the connection between the host machine and the experimental box

Experiment 5 HelloWorld experiment under VS2005

Experiment 6 window experiment

Experiment 7 Dialog dialog box experiment

Experiment eight buzzer experiment

Experiment 9 1.8-inch LCD screen experiment

Experiment 10 LEDARY lattice experiment

Experiment 11 Eight-segment digital tube experiment

Experiment 12 LED experiment

Experiment 13 DIP switch experiment

Experiment 14 IIC bus-temperature sensor test

Experiment 15 IIC bus-EEPROM experiment

Experiment 16AD experiment

Experiment 17 RS232 communication experiment

Experiment 18 RS485 communication experiment

Experiment 19 6-in-1 sensor experiment (requires 6-in-1 expansion module)

Experiment 20 camera collection experiment

Experiment 21 Matrix Keyboard Experiment

Experiment 22 SIXKEY Interruption Experiment

Experiment 23 Fingerprint experiment (requires fingerprint module)

Experiment 24 Zigbee experiment (requires Zigbee module)

3.2LINUX experiment

Experiment 1 Install VMware Workstation software

Experiment 2: Install UBUNTU operating system

Experiment 3: Establishing a host cross-compilation development environment

Experiment 4 Install and configure minicom

Experiment 5 Configuring HyperTerminal

Experiment 6 Configuring NFS Service

Experiment 7 Configuring TFTP

Experiment 8 Compile x-loader

Experiment 9 Compiling U-Boot

Experiment 10 Compile KERNEL

Experiment 11 Compile POMAP

Experiment 12 Deploy file system

Experiment 13: Connecting to the target board

Experiment 14: Format SD card

Experiment 15: Start the system through SD card

Experiment 16: Burn image to NAND FLASH through SD card

Experiment 17: Burn the image to NAND FLASH through TFTP

Experiment 18 starts via NFS

Experiment 19 Simple Procedure

Experiment Twenty HelloWorld Experiment

Experiment 21 GPIO experiment SWITCH

Experiment 22 IIC experiment (reading and writing EEPROM)

Experiment 23 SPI experiment (AD7792)

Experiment 24 LED dot matrix experiment

Experiment 25 digital tube experiment

Experiment twenty-six LED experiment

Experiment twenty-seven DSP experiment

Experiment twenty-eight button interruption experiment

Experiment twenty-nine touch screen experiment

Experiment 30 QT experiment

3.3Android experiment

Experiment 1: Establishing JDK, an application development environment under Windows

Experiment 2 Install Eclipse

Experiment 3 Install and configure ADT and Android SDK

Experiment 4 Android emulator operation

Experiment 5 Android Hello application development

Experiment 6: Install VMware Workstation virtual machine software

Experiment 8 Installing Ubuntu system in a virtual machine

Experiment 9: Establishing a host development environment

Experiment 10 Install JDK1.5

Experiment 11 configure minicom

Experiment 12: Configuring HyperTerminal

Experiment 12 Configuring TFTP

Experiment 13 Compile U-boot

Experiment 14 Compile x-loader

Experiment 15: Compile LINUX kernel

Experiment 16: Compile Android and create file system

Experiment 17 SD mode startup

Experiment 18 Android application technical support and service

Provide hardware schematic diagrams, hardware PCB diagrams, and software design resources.

 

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